主催: 一般社団法人 日本機械学会
会議名: 2017年度 年次大会
開催日: 2017/09/03 - 2017/09/06
Our research team are now trying to develop a novel water cooling device for electrical devices using pulsating flow. In order to increase heat exchange performance of cooling devices while decreasing power consumption of fans and pumps, a novel technique of flow control should be developed. We are investigating an application of pulsating flow to water cooling devices for high-density packaging electronic equipment. In this report, we especially focused on a pulsating wave pattern of supply flow rate. A relationship between the pulsating wave patterns and the heat transfer performance of the combination of the rib and the pulsating flow was investigated through 3D-CFD analysis. Through the analysis, we clarified that the pulsating wave pattern affects the heat transfer performance around the ribs. Especially, it was found that an optimization the transient change of the supply flow rate in the acceleration period may achieve the higher heat transfer performance by the pulsating flow while decreasing the pressure drop around the rib.