Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 09, 2018 - September 12, 2018
In the compression molding process of fine ceramic, ceramic particles adhere to molding dies, and then cleaning is necessary to keep product qualities. However, the cleaning operations decrease productivity. Thus, it is required to clarify the effect of compression molding conditions on residual of ceramic particles on the mold surface for developing molding processes suppressing adhesion of the particles. In this study, we focus on the effect of compressive force and relative humidity of atmosphere, using alumina. From experimental results, it is clarified that the residual amount of the particles on the mold surfaces decreases with increasing of the compressive force. As the compressive force increases, the porosity of molded ceramic form also decreases. It is considered that high coordination number of the particle in the dense ceramic form may prevent the particles from adhering on the mold surfaces. When the relative humidity increases, the amount of residual particles increases. Because the increasing ratio from 50%RH to 70%RH rises drastically, meniscus between each ceramic particle and the mold surface can be considered as one of the important factors generating residual particles.
