高発熱密度環境における銀ペーストの接触熱抵抗評価

抄録

This study describes the evaluation of thermal contact resistance under high heat flux. Next-generation semiconductor devices have advantage, which are high voltage device, and can be used under very high temperature and high heat flux. The contact thermal resistance of TIM (Thermal Interface Material) used at high temperature, thus, should be evaluated. Ag paste is expected as TIM used at high temperature. In this study, the contact thermal resistance is experimentally evaluated by steady state method. The experimental apparatus has heat transfer surface of φ 20.0 mm, and applied contact pressure to the heat transfer surface is 0.09 MPa. The results show that the temperature gap between the heat transfer surfaces show complete different tendency before / after solidification of the Ag paste.