PCMとポリエチレン，銅の複合化による昇温抑制材料の開発

抄録

Recently, since mobile electronic devices such as mobile phones employ ultrahigh-density mounting techniques, a larger amount of heat generation occurs due to the techniques. Therefore, new cooling technology is required to avoid serious troubles on the electronic devices caused by overheating. Phase change materials (PCMs) attract attention to solve the heat problem of mobile phones. PCMs are expected to be used as heat-absorbing materials, i.e., to avoid excess temperature rise of the mobile phones, PCMs is applied to case materials or base materials such as substrate of mobile phones. In this study, the mechanical properties, in particular heat storage property and tensile deformation characteristics are evaluated experimentally as a first step of the evaluation of the reliability and safety. A method to improve a mechanical characteristic of the composites is proposed considering the basic mechanical properties of the composite fabricated using hot press method. The heat storage performance of the composites is also confirmed using the differential scanning calorimetry (DSC). The thermometry examination of the surface of the composite is conducted using thermography. Copper (Cu) sheets are employed in the composite to improve strength of the composites. As a result, it can be found that the composites have enough properties as a heat storage and also that the tensile strength of the composites should be improved.