Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 13, 2020 - September 16, 2020
In next-generation power modules, the mounting of the power semiconductor chip using GaN and SiC, which can work in high-temperature environments over 200°C, is demanded. For the mounting, the lead-free solder with a melting point of around 200°C and high melting point solders containing harmful lead cannot be used. So in late years, the sinter bonding using Cu3Sn, which is a Cu/Sn intermetallic compound, attracts attention. For the practical use of the bonding, it is necessary to clarify the strength reliability of the Cu3Sn. Therefore, in this study, to evaluate the deformation properties of the Cu3Sn, a micro-indentation tests are carried out at temperature from room temperature to 200°C for a bulk sample of Cu3Sn made using the arc melting method. According to these results, Young's modulus and tensile strength of Cu3Sn in each temperature are estimated. And it is found that the amount of inelastic deformation increases with a rise in temperature.
