主催: 一般社団法人 日本機械学会
会議名: 2020年度 年次大会
開催日: 2020/09/13 - 2020/09/16
This study describes a next-generation heat transfer enhancement method of miniaturized heat exchangers by an application of pulsating flow. About recent cooling devices used in high-density packaging electronic equipment, both miniaturization and high heat exchange performance are required while decreasing pumping power. However, due to the miniaturization of the heat exchangers, the flow passages become narrower and higher pressure drop is caused. In order to avoid this problem, our study focuses on a pulsating flow. In this paper, against the result of the pulsating flow, a possibility of heat transfer enhancement by the pulsating water flow was investigated through the experiment. In the range of this report, it is found that the heat transfer enhancement by the pulsating flow can be confirmed regardless of the time-averaged Reynolds number. In addition, from the viewpoint of the cooling performance, we confirmed the possibility that the application of the pulsating flow can enhance heat transfer around the obstruction while decreasing the time-averaged supply flow rate.