Towards the establishment of ultra-precision processing technology and bonding technology for hard-to-machine semiconductor substrates for advanced 3D structural devices

Abstract

Realization of high-performance and multi-function devices is required due to technological trends that are conscious of singularity with AI, deep learning, and IoT as keywords. In order to introduce a wide variety of functional materials to achieve fine three-dimensional and multi-functionalization, 1) super-precision machining of constituent materials, 2) ultra-thin-processing, and 3) wafer-boding are three major Key technologies. In order to contribute to the device fabrication of wide-gap semiconductor substrates such as SiC, GaN, and diamond in the near future, which is currently in the spotlight, it is introduced that the innovative plasma fusion CMP technology which fuses plasma processes and the ultra-precision wafer bonding technology. The process technology that fuses these is expected to become a key technology for highly efficient creation of innovative devices.