難加工基板材料向け高速高圧研磨プロセスの評価

抄録

Silicon carbide (SiC) and Gallium nitride (GaN), which are expected as next-generation power semiconductor materials, are hard-to-process materials. We have developed a high-speed and high-pressure polishing machine (SLM-140H) for aiming at hard-to-process materials. Using this machine, a high polishing rate was obtained compared to conventional conditions. This machine has a function to measure and record various parameters during polishing, such as a load cells and pad surface thermometer. In this paper, we analyzed and evaluated parameters such as load cells value and pad surface temperature , and clarified the polishing state under high-speed and high-pressure conditions.