主催: 一般社団法人 日本機械学会
会議名: 2023年度 年次大会
開催日: 2023/09/03 - 2023/09/06
In this study, thermal induced flow around a set of rectangular blocks modeled from stepped Al-Ga-As / Ga-As-Si semiconductors set in a microchannel is simulated by solving the Navier-Stokes equation with velocity slip and temperature jump conditions on the wall. The surface temperature on one side of each rectangular block was set higher than that on the other. The simulation results suggest that the pressure increases from low temperature surface to high temperature surface of rectangular blocks stepwise and that the computational model plays the role of a pump by generating thermal induced flow around each block.