負荷速度が異なる圧子押込み荷重‐変位曲線を用いた定常クリープ則の導出への粒子群最適化法の適用

抄録

For accurate evaluation of the reliability of the electronic package, FEAs considering the creep deformation of solder joints in situ should be conducted. To conduct such FEAs, a testing method that can evaluate the creep properties of the solder joints in situ must be developed. It is desired that the method is a simple test to evaluate the creep deformation in the microscopic region by pushing only the indenter into the specimen. Because of the measurement data is affected by temperature drift caused by the load maintenance process at long times. In this paper, the method to derive the steady-state creep law using the indentation load-displacement curves with different loading rates was proposed by applying the particle swarm optimization (PSO) method. The availability of the proposed method was verified by FEA and the experiments of the indentation test for Sn-3.0Ag-0.5Cu (SAC) solder. It is possible to identify the appropriate constants of the steady state creep law and the standard of strain calculation by the proposed method.