粉体圧縮成形を用いて積極的に導電性パスを形成したPC/VGCFの機械的性質に及ぼす成形温度の影響

抄録

PF-PC/VGCF is formed by heating at a temperature below the melting point, as in powder metallurgy, to soften only the surface of the base material powder (PC powder) and bond the adjacent base material powders together. In this case, VGCF will exist between the base resin powders. The volume of this bond between base resin powders depends on the molding temperature. By changing the molding temperature, the softened region of the PC powder surface changes, which may change the strength of the composite material. Since VGCF and PC have poor wettability, the bonding strength between PC powders may decrease depending on the molding temperature. In this study, with the aim of clarifying the mechanical properties of PC/VGCF produced by powder compression molding, we clarified the bonding force between PC powders by varying the molding temperature while keeping the amount of VGCF constant. As a result, the bonding strength between PC powders was clarified by changing the molding temperature while keeping the amount of VGCF added constant. The bending strength of PF-PC/VGCF decreased when the forming temperature was low, and increased when the forming temperature was high, and was comparable to PC. Even when the forming temperature changed, the flexural modulus remained almost unchanged. As the local VGCF content of PC/VGCF changes due to changes in molding temperature, it is necessary to mold at an appropriate molding temperature.