抄録
An interface delamination in IC Packages is a critical issue in both structural design and material selection of plastic IC packages. The 3-D finite element analyses were carried out to examine the stress-intensity factor of delamination interface in IC packages subjected to steady and non-steady thermal stresses. The stress-intensity factor K associated with a thermal interface crack was evaluated by the modified crack closure integral. The conditions of thermal stress, which were steady and non-steady thermal stresses, were compared. Especially, it is considered that K_<III> could not be neglected at the corner part in IC Packages. Therefore, the 3-D finite element analysis is indispensable to the estimation of the stress-intensity factors at the corner part in IC packages.
