Abstract
A suspension with IC-chip, what is called "Chip On Suspension (COS)" is most effective technology to increase data transfer rate of hard disk drives (HDDs). One of the most concern of COS is thermal affective of head suspension. This report is primary experimental study to control the temperature and the displacement of COS. The experimental results are follows. Temperature rises of IC-chip and slider displacements are almost proportional to heating power. The effect of airflow influence temperature distributions of COS, the unbalanced temperature distributions cause slider displacements.
