Development of Reliability Evaluation System using Stochastic Finite Element Method on coupled problem

Abstract

This paper describes a new estimation method for mean and variances of responses on coupled problem between heat conduction and thermal stress analyses using stochastic finite element method. We applied this method to estimate the reliability of the solder connection part of a multi chip module. As a result, we could recognize the influence of the calorific value in LSI using this method as well as the Monte Carlo method.