Development of High-speed electroplating method of a wire for slising a silicon ingot

Abstract

An electroplated slicing wire with diamond abrasives is demanded for silicon wafer making process because of its long tool life and high productivity. Although It has a serious problem for its production that the electroplating rate in conventional method is generally very low under 1μm/min. Therefore brush plating method which is one of the high speed plating techbiques has been tried to apply for the wire production. After various kinds of the modifications and tests to fit for wire production, next results were identified. : (1) Nickel sulfamate bath is the most suitable for brush plating. (2) Manufacturing time could be shortened by higher current density in this plating process than that in the conventional. (3) Quality of plating depends on maximum current density of circuit and revolution of brushing wheel. (4) Density of plated abrasives on a wire depends on revolution and felt brush structure of brushing wheel. (5) The wire by this plating method has higher slicing performance than a conventional one.