814 コンパクト電子機器熱設計のためのビルドアップアプローチ

抄録

This paper describes a JSME project that is aimed at implementing a methodology called the Build-up approach (BUA). The BUA is designed to expedite thermal design of electronic equipment through hierarchical organisation of the design work. In the knowledge development level, the computational fluid dynamics (CFD) simulation is performed on a set of template designs. From the solution body a fast-to-use design code will be developed for use in the actual design phase. Expected benefits of and the key steps involved in the BUA are explained.