抄録
In developing a new switching power supplies, detail thermal assessment of the complete system was very time consuming and expansive process. Therefore it was very much desirable to use some engineering tool which could drastically reduce both time and cost required for the development process. In the present work, a thermo-fluid simulation technique is used as an engineering tool in the thermal designing of switching power supplies. The modeling and development of analytical condition for the individual components necessary for the simulation are studied and the results are presented. The result lead to the understanding that the proposed simulation technique is very effective in the designing of arrangements of the components mounted in the printed circuit board.
