The proceedings of the JSME annual meeting
Online ISSN : 2433-1325
2003.1
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Transient Thermoelastic Analysis of a Functionally Graded Cylindrical Panel Under Heated and Cooled Processes
Motohiro YAMASHITAYoshihiro OOTAOYoshinobu TANIGAWA
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Pages 179-180

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Abstract
This study is concerned with the theoretical treatment of transient thermal stress problem involving functionally graded cylindrical panel under heated and cooled processes. We obtain the approximate solution for two-dimensional temperature change in a transient state, and thermal stress of simple supported cylindrical panel under the state of plane strain. As an example, numerical calculations are carried out for a functionally graded material of aluminum alloy/alumina, and the behaviors are examined from the initial state of heating to the steady state of the cooled process.
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© 2003 The Japan Society of Mechanical Engineers
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