Abstract
Silicon chips used for electronic devices become smaller and thinner. It leads to strength problems in manufacturing processes. Silicon semiconductors are almost pure crystals, but the chips have numerous defects on their surfaces induced by grinding and dicing processes. To make strength properties clear, three-point bending test of 5-10mm span was conducted for both etched and non-etched chips. The strength evaluated in terms of the maximum stress of a bended beam was scattered in the range of 0.1 to 5Gpa with multiple peaks. Strong size effect was observed and some of the factors influent the strength properties were identified by SEM observation and Weibull analysis.
