抄録
The thin-film is used for various industrial products. At present, sputtering method is mainly applied for thin-film formation process. A sputtering target must be supplied with high power to increase film growth rate, then, cracks appear on a target. A sputtering target consists of target material, bonding material and backing plate. The purpose of this study is to construct a design support system for optimal dimension and shape of the sputtering target. In this report, a warpage in joining the target material to backing plate is predicted by FEM. In addition, the residual stress in sputtering target is also predicted by the FEM.
