Trend of the laser micro-via drilling technology for PWB

Abstract

Recently, the laser micro-via drilling technology was induced to reduce the size and weight of personal cell phone. In 1996,Matsushita electric was developed ALIVH PWB^(TM) (A__-ny L__-ayer I__-nterstitial V__-ia H__-ole P__-rinted W__-iring B__-oard) using laser via-drilling process. Then the smallest cell phone (NTT Docomo P201), had only 98g weight, was realized. Within few years, laser micro-via formation technology was adapted for new field, for example LCD driver Flex-PWB, SAW filter, CCD, MPU and Sip (System in Package) Packages. In this paper, trend of the laser micro-via drilling technology was represented within few years.