抄録
To prevent fatigue failure and improve fatigue strength of fine cupper wire used in electronic equipment, evaluation method of fatigue strength has been developed. The fatigue specimen was consisted of a 50μm diameter wire, film and adhesive which bonds wire to film. Since very thin wire is used, the value of stress in wire was greatly influenced by the property of the adhesive. Six type of specimen, which shape of wiring, sort of adhesive and wire fixation were different, were used in this study. Fatigue strength of these specimens was expressed in a line by the results of elasto-plastic finite element stress analyses.
