The proceedings of the JSME annual meeting
Online ISSN : 2433-1325
2004.1
Session ID : 1133
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Analysis of a stress singularity field in three-dimensional bonded structures using three-dimensional bundary element method
Hideo KOGUCHIMasao SATOH
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Abstract
Stress singularity at a vertex in three-dimensional joints is closely related to the strength of joints. The characteristic of stress distribution near the vertex in three-dimensional joints is not made clear until now. There are several methods for joining two different materials. Bonding method using adhesives is widely used to manufacture electronic devices, panels in air planes and so on. The thickness of adhesive will influence on the stress intensity at the vertex. In the present study, we investigate the relationship between the stress intensity factor at the vertex and the thickness of adhesive. It was found that the intensity of stress at the vertex rises with increasing the thickness of adhesive.
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© 2004 The Japan Society of Mechanical Engineers
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