抄録
This paper presents the experimental results regarding the thermal performance of a PBGA package model mounted on a printed circuit board in a thin compact casing. The casing exit was linked with an exhaust duct that has an orifice plate for flow rate measurement and an exhaust fan. The effect of the relative position of the PBGA package and a cooling air inlet on the thermal performance was examined. It is confirmed that air flow through a narrow inlet diffuse slightly and that increasing the streamwise distance between the package and the inlet has a limited effect.
