Abstract
We developed a new evaluation method of compressive residual stress of chemical vapor deposited diamond film using laser spallation technique. Spallation produced a circular delamination with slight bulging by several hundreds of nano-meter. The residual stress was evaluated by geometrical momentum balance of the circular patched plate of delamination. Residual stress of -338MPa for microcrystalline diamond film agreed well with one obtained by X-ray diffraction method of -348MPa. Residual stress of diamond film tended to decrease with decrease of crystalline size of diamond film.
