In order to investigate on material testing of piezoelectric thin film fabricated on a substrate, the deformation behaviors under electric field have been analyzed by finite element method. The effect of thickness and length of the substrate was evaluated, and then displacement response was investigetd by changing the thickness of piezoelectric thin film and the radius of top electrode. The computational results indicated that the single-point displacement mesearing is effective for only thick substrate without deflection, and that there is no dependence of the specimen size if the radius of top electrode is over 100μm. On the other hand, the double-point displacement mesearing is available for not only thick but olso thin substrates. 100μm is the best radius of top electrode for evaluation of psedo-piezoelectric strain constant.