3556 Creep Fatigue Life of Sn-3.5Ag Solder at Low Temperatures
Details
This paper describes the creep-fatigue lives of Sn-3.5Ag solder at low temperatures. Push-pull creep-fatigue tests were carried out at 273K to examine the effect of temperature and strain rate on fatigue life. Slow tension-going straining was more detrimental to lifetimes than slow compression-going straining. Strain range partitioning (SRP) method was a suitable parameter for the correlation of creep-fatigue lives. The SRP method using 313K data predicted almost all of the experimental lifetimes within a factor of 2 scatter band. Many small cracks with roughened surface were observed in the specimen after tests.
