3557 Strain Rate Dependency of Strength Properties of Lead-Free Solder
Details
Evaluation of reliability for the impact strength of solder joints have been coming an important issue related to the miniaturization, lightweight and multi-functionalization of portable information equipments. However, there are few data about the deformation characteristic and the strength property of lead-free solder at the high strain rate, which can be used as the basic data of stress analysis. In this study, the tensile tests at room temperature and 125℃ were carried out for Sn-3.OAg-0.5Cu lead-free solder, in order to investigate the tensile property in the strain range from low strain rate to high strain rate. As a result, it was found that the tensile strength increases with the increase in strain rate.
