3956 折れ曲がるバンブー構造配線のエレクトロマイグレーション損傷しきい電流密度(S21-3 強度物性と信頼性,S21 ナノ・マイクロ構造体の強度物性と信頼性)

抄録

It is known that there is a threshold current density of electromigration damage in the via-connected line. The evaluation of the threshold current density is one of the great interests from the viewpoint of IC reliability. In this study, metal lines with two-dimensional shape, i.e. angled metal lines are treated. The evaluation method of the threshold current density is applied to the metal line. The method is based on the numerical simulation of the building-up process of the atomic density distribution in bamboo lines by using the governing parameter for electromigration damage. Comparing the evaluated results with that of straight-shaped line, the effect of line-shape on the threshold current density of electromigration damage is discussed. Furthermore, the obtained difference in the threshold current density is verified experimentally.