4332 Strength and Life Reliability on Semiconductor Substrate by Difference Bond Methods

Abstract

In this research, we did thermal cycle test, four point bend test, and the simulation analysis by finite element method (FEM) to DBC and AMC semiconductor substrate. We examined influence of thermal-residual stress on the life reliability of the substrates, and did the basic research for establishing a profitable strength evaluation method through the comparison with the two kinds of joint methods. It is clarified that the AMC substrate is more excellent than the DBC substrate from the viewpoint of strength and the longevity reliability of the semiconductor substrate.