抄録
The present paper proposes a simple method to test electromigration resistance of solders. One of the key points of the present method is the fabrication of a simple solder sample that can produce sufficient current density to cause electromigration. Moreover, the actual local temperature of a small area subjected to electromigration in the sample is measured by a direct method. By comparing the electromigration behavior of Pb-free solders as a function of current density, associated time and electromigration temperature, the corresponding resistances of the solders against electromigration will be evaluated.
