1204 めっき錫バンプと銅薄膜配線間金属間化合物の機械特性(S05-1 ナノ・マイクロ材料の強度・信頼性(1)銅薄膜の強度物性,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)
詳細
Residual stress in the bump joint structures that consist of copper thin films and lead-free solder bumps with intermetallic compounds(IMC) between them was analyzed by using a finite element method as a function of the thickness of the IMC. It was found that the stress and strain fields around the bump/interconnection changed dramatically depending on the thickness of the intermetallic compound.
