Nanoindentation tests are used as a means to determine the elastoplastic properties of thin film deposited on the substrate. For this purpose, the quantities of the thin film must be decoupled from those of the substrate, and it is important to understand how the substrate influences the entire indentation process. We have carried out extensive finite element simulations on this indentation problem and found a new phenomenon. The measured hardness overshot the substrate hardness in a certain combination of the elastoplastic properties of the film and the substrate materials.