Abstract
This paper presents a design support methods to evaluate thermal fatigue life of solder balls on Ball Grid Array (BGA) package. Authors have investigated relations between the design factors and the reliability of soldered joints in BGA model by using clustering analysis. Based on relations between design factors and characteristic value, a function estimating inelastic strain range, which is the characteristic value for thermal fatigue life, was developed. The function can estimate the value to a set of design factors within 20% error.
