Abstract
The effect of crystallographic orientation on Fatigue crack growth behavior of single crystal superalloy CMSX-4 has been examined in the room temperature, 500℃, 700℃, and 900℃. Loading direction and initial crack direction were [001]・[010], [011]・[011^^-], and [111]・[112^^-] respectively. At room temperature crack growth occurred on the {111} octahedral slip planes at an oblique angle to the loading direction, while at high temperature crack growth occurred Mode I type failure process. Crack growth rate were discussed in terms of the effective stress intensity factor range which considers the effect of elastic anisotropy and inclined crack.
