抄録
This study describes the sensitivity of acoustic microscopy for detecting three-dimensional defects in a Si structure. A number of nanometer height circular gaps with diameters ranging from 5 to 1000 μm were successfully embedded in Si disks by a direct bonding technique, and these were tested with different conditions of acoustic imaging. The sensitivity of gap detection is found to be dependent the three-dimensional features of the embedded defects, their positions, and the intensity of ultrasound applied to the gaps. The acoustical interaction with nanometer gaps is interpreted by a simple mechanical model.
