J0103-1-1 Effects of Shear Loading on Fracture Strength of Joints in Electronic Device

Abstract

Shear loading tests were executed to ceramics/metal joints used for an electronic device in various temperatures and loading rates. Fracture origin of the joints is formed from ceramics of interfacial neighborhood. According to FEM analysis, it is clarified that the driving force for the failure is not a shear stress but a tensile stress. The tensile stress dramatically decreases from just beneath the surface to interior portion. Slow crack growth behavior in nominal shear stress was estimated using fracture mechanics in the different conditions of loading rates.