Fundamental thermal performance of a liquid cooling system for small electronic equipment has been studied. A liquid cooling system is attracting attention because an increase of heat generation density in electronic components requires effective cooling. The cooling system proposed in this study uses a Mini-tube and a Microencapsulated Phase Change Material (MEPCM). The coolant including the MEPCM with an average diameter of 3 μm was supplied into the Mini-tube having a diameter of 1 mm. The mass concentration of MEPCM was changed from 0 to 5 %. The increase of the MEPCM mass concentration reduces the temperature rise of the heated tube wall.