抄録
The transient process of a liquid film flow that covers a rotating substrate in the spin coating process was analyzed by a 3-D computational simulation using the finite difference method. Evaporation of solvent and change of thermophysical properties such as viscosity was taken into account The case of nonuniform temperature distribution of the substrate was analyzed applying ring-like and spot-like high temperature region on the substrate, and it was concluded that hot ring/spot on the substrate results in large final film thickness on those ring/spot. As a special case of the spin coating, the drying process of the coating liquid on a substrate that was not rotating was also simulated, and it was found that the hot range on the substrate produces complicated profiles of the final film thickness.
