抄録
In recent years, calorific power of computer chip has been increasing, thus high performance cooling unit is desired. Further, it is desired that it's performance dose not depend on any posture of chip. We developed the cooling unit that complied with the demands. It has the boiling part that enabled to supply refrigerant to boiling part with sintering metal, and the condensation part that enabled to spread high temperature vapor of coolant without clogging.
