抄録
The design value of a silicon wafer polishing machine such as radius ratio, rotational velocity ratio, attachment position, rocking cycle and rocking amplitude has great effect on planarization of the silicon wafer. Relative velocity is one of factors which determines polishing quantity. The purpose of this study is optimization of the design value of polishing machine for planarization of the silicon wafer. In this paper, relative slide distance was substituted for polishing quantity and it was investigated how design value influenced relative slide distance.
