Proceedings of JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment : IIP/ISPS joint MIPE
Online ISSN : 2424-3132
2003
会議情報
P-CM-04 FEM Analysis of Multilayered MEMS Device under Thermal and Residual Stress
Jun Hyub ParkHyeon Chang Choi
著者情報
会議録・要旨集 フリー

p. 333-334

詳細
抄録
It is essential to ensure their reliability to produce a MEMS on commercial scale. Reliability problem in inkjet printhead is also very important. To eject an ink drop, temperature of heater must be high so that ink contacting with surface reaches above 300℃ on the instant. Its heater is embedded in the thin multi-layer in which several materials were deposited. MEMS processes are the main sources of residual stresses development. Residual stresses are the main factor reducing the reliability of MEMS devices. We measure residual stresses of single layers that consist of multiplayer. We optimize thickness of each layer using them so that maximum stress in residual stress distribution can be minimized.
著者関連情報
© 2003 The Japan Society of Mechanical Engineers
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