407 太陽電池向けシリコンウエハの強度評価(OS4-1 先端材料システムの力学とメゾスケールモデリング,OS4 先端材料システムの力学とメゾスケールモデリング)

抄録

Recently, the photovoltaics of polycrystalline silicon cell have been extending its front into all over the world and it is also desired to establish the reliability assessment. This paper describes a strength evaluation of polycrystalline silicon for photovoltaic cell by use of the fracture mechanics taking into account the surface damage due to the manufacturing process such as a wafer slice. An attempt is made to evaluate the bending strength of polycrystalline silicon wafer and to evaluate the surface damage by TEM and Raman spectrometry. It is found the huge micro cracks exist at the surface, and these cracks can be modeled as through crack by using fracture mechanics analysis.