The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2007
Session ID : 802
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802 Evaluation of Mechanical Properties of In-service Solder Joints by Indentation Method
Takeshi OGAWA, Takaaki NAKAMURA, Tomio HAYASHI
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Keywords: Nanotechnology, Hardness, Heat Treatments, Creep, Mechanical Properties, BGA, Indentation, Dual-indenter Method
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[in Japanese]
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© 2007 The Japan Society of Mechanical Engineers
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Proceedings of the 1992 Annual Meeting of JSME/MMD

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