601 三次元積層半導体チップの熱伝導特性と変形特性(OS6-1 シリコン貫通ビア技術と強度信頼性)

抄録

In this study, equivalent material properties of thermal conductivity, Young's modulus, Shear modulus and Poisson's ratio for through silicon via (TSV) layer and micro bump layer in 3D SiP were estimated by FEM simulation. These equivalent material properties showed anisotropy depend on the structure of materials in TSV layer and micro bump layer. Equivalent material properties estimated by mixing rule showed some solutions depend on materials' arrangement and these values were different from the equivalent material properties estimated by FEM simulation. It showed the necessity and advantage of FEM simulation in case of complex arrangement of materials like TSV layer and micro bump layer in 3D SiP.