抄録
Strength of solder joint with 61.9Sn-38.1Pb lead solder or Sn-3.5Ag-0.75Cu lead free-solder was studied. This study focuses on the effect of loading rate and bonding area on the strength of bonding joint. This experiments have been carried out under biaxial loading at room temperature for both solders. Based on the results, it is found that the bonding strength increases with increasing loading rate, but the effect of bonding surface on the bonding strength are not so large. Comparisons between tensile strength and torsional strength were also discussed
