OS2401 Equivalent thermal conductive properties and equivalent elastic properties of fine structure area in 3D SiP

Abstract

In this study, equivalent material properties of thermal conductivity, Young's modulus, Shear modulus and Poisson's ratio for through silicon via (TSV) layer and micro bump layer were estimated by FEM simulation. These equivalent material properties showed anisotropy depend on the fine structure of materials in TSV layer and micro bump layer. Response surface of these equivalent material properties were made by using plan of experiment method. Equivalent material properties that are difficult to be derived by the mixing rule can be efficiently derived by using the response surface.