Abstract
3D IC packaging has been receiving increased attention for system performance enhancements without relying on further device scaling. Recently, 2.5D IC packaging has been proposed as a more realistic approach, in the view point of supply chain, design rules, and yield. However, 2.5D & 3D IC packaging have technical challenges, such as in the thermal and mechanical point of view. In this paper, the trend and technical challenges of 2.5D & 3D IC packaging are described.
