OS1802 Improvement of the nonlinear finite element analyses for a 3D SIC package using the thermal strain measurement with scanning electron microscope and the digital image correlation

Abstract

Numerical methods such as the finite element method (FEM) have been used to evaluate the reliability of electronic packages. However, it is difficult to assure the accuracy of numerical analyses of electronic packages, which require nonlinear analyses. In this study, we evaluated the thermal strain of a test chip for three-dimensional stacked integrated circuits (3D SIC) with both measurement and numerical analyses. First, the distribution of the thermal strain on the cross-section of a test chip was measured using scanning electron microscope (SEM) and the digital image correlation method (DICM [1]). Then, the distribution of strain of the test chip was also analyzed by the FEM considering the viscoelastic material properties of underfill (UF) resin [2] measured with the stress relaxation test and the elastic-plastic material properties of components measured with nano-indentation tests [3]. We improved the accuracy of the nonlinear finite elemant analysis using strain measurements made by the SEM-DICM.