OS1806 Effect of Thermal Cyclic Load on Phase Growth in Solder Joint

Abstract

In order to evaluate the thermal fatigue of the Sn-3.0Ag-0.5Cu solder joint on the electronic substrate, elastic-plastic creep analysis in a solder joints was conducted using the finite element method. It was shown clearly that the temperature range and the average temperature influenced the thermal crack initiation lifetime. The thermal load history of solder joints was presumed. The approximation process of the load history and residual life of solder joints was discussed.